ADI公司的一本将线性模拟电路设计的书，非常经典，适合做模拟硬件设计的童鞋们阅读

模拟电路设计，国外本科教育经典教材。 教材全本下载

Preface................................................................................................ vii Part I: RF Circutis: wide band, Front-Ends, DAC’s Introduction ........................................................................................ 1 Ultrawideband Transceivers John R. Long ...................................................................................... 3 High Data Rate Transmission over Wireless Local Area Networks Katelijn Vleugels................................................................................ 15 Low Power Bluetooth Single-Chip Design Marc Borremans, Paul Goetschalckx ................................................. 25 RF DAC’s: output impedance and distortion Jurgen Deveugele, Michiel Steyaert................................................... 45 High-Speed Bandpass ADCs R. Schreier .......................................................................................... 65 High-Speed Digital to Analog Converters Konstantinos Doris, Arthur van Roermund........................................ 91 Part II: Design Methodology and Verification for RF and Mixed-Signal Systems Introduction ........................................................................................ 111 Design Methodology and Model Generation for Complex Analog Blocks Georges Gielen................................................................................... 113 Automated Macromodelling for Simulation of Signals and Noise in Mixed-Signal/RF Systems Jaijeet Roychowdhury ........................................................................ 143 A New Methodology for System Verification of RFIC Circuit Blocks Dave Morris........................................................................................ 169 Platform-Based RF-System Design Peter Baltus ........................................................................................ 195 Practical Test and BIST Solutions for High Performance Data Converters Degang Chen ...................................................................................... 215 Simulation of Functional Mixed Signal Test Damien Walsh, Aine Joyce, Dave Patrick ......................................... 243 Part III: Low Power and Low Voltage Introduction ........................................................................................ 249 The Effect of Technology Scaling on Power Dissipation in Analog Circuits Klaas Bult ........................................................................................... 251 Low-Voltage, Low-Power Basic Circuits Andrea Baschirotto, Stefano D’Amico, Piero Malcovati ................... 291 0.5 V Analog Integrated Circuits Limits on ADC Power Dissipation Ultra Low-Power Low-Voltage Analog Integrated Filter Design Wireless Inductive Transfer of Power and Data Robert Puers, Koenraad Van Schuylenbergh, Michael Catrysse, Bart Peter Kinget, Shouri Chatterjee, and Yannis Tsividis........................ 329 Boris Murmann .................................................................................. 351 Wouter A. Serdijn, Sandro A. P. Haddad, Jader A. De Lima ............ 369 Hermans ............................................................................................. 395

Fundarental of RF and Microware circuit Design

模拟滤波器与电路设计手册

Part I Semiconductor Devices and Basic Applications;Part II Analog Electronics;Part III Digital Electronics

Microelectronics: Circuit Analysis and Design, 4th edition SOLUTION By D. A. Neamen

电子电路分析与设计:半导体器件及其基本应用 纽曼 (Donald A.Neamen)、王宏宝 电子电路分析与设计:模拟电子技术 纽曼 (Donald A.Neamen)、王宏宝 电子电路分析与设计:数字电子技术(第3版) 纽曼 (Donald A.Neamen)、王宏宝 数字电子技术 作　　者：（美）弗洛伊德 著，余璆 等译

Preface Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition, is a significant enhancement to the first edition. The first edition was well received within the engineering community worldwide and was translated into international languages. The intent of the present volume is to expand upon concepts presented in the earlier edition, to justify why a specific design technique works, and to show when it is appropriate for use. Additional techniques based on technological changes within the last few years are also incorporated. These techniques and enhancements are based on questions, comments, and discussions received from engineers around the world. This book presents information never before published within the engineering community, dealing exclusively with printed circuit boards (PCBs). When writing the first edition, it was impossible to anticipate the amount of variations possible, or what the intended audience expected from a book directed toward nondegreed engineers. A thorough understanding of the concepts presented herein will assist during the design and layout process. Note the key word here —"concepts." Printed Circuit Board Design Techniques for EMC Compliance will help minimize the emission or reception of unwanted radio frequency (RF) energy generated by components and circuits, thus achieving acceptable levels of electromagnetic compatibility (EMC) for electrical equipment. The field of EMC consists of two distinct areas: 1. Emissions: Propagation of electromagnetic interference (EMI) from noncompliant devices (culprits) and, in particular, radiated and conducted electromagnetic interference. 2. Susceptibility or immunity: The detrimental effects on susceptible devices (victims) in forms that include EMI, electrostatic discharge (ESD), and electrical overstress (EOS). The primary goal of the engineer is to ensure proper operation and performance of a product when used within an intended electromagnetic environment. These design requirements are in addition to making a product function as desired for use within a specific, end-use environment. Information presented in this guideline is intended for those who design and layout printed circuit boards. EMC and compliance engineers will also find the information presented herein helpful in solving design problems at both the PCB and system level. This book can be used as a reference document for any design project. The focus of this book is strictly on the PCB. Containment techniques (shielding), internal and external cabling, power supply design, and other system-level subassemblies that use PCBs as a subcomponent will not be discussed. Again, as in the first edition, excellent reference material on these aspects of EMC system-level engineering is listed in the References section at the ends of chapters.

Printed Circuit Board Designers Reference Basics